EXPERIMENT 01
Photolithography: Fabricating Micro-QR Codes
(Instructor Guide)
PART 1: INSTRUCTOR’S GUIDE & PREPARATION
(Confidential: For Teaching Assistants and Faculty Use Only)
1. Experiment Overview
In this experiment, students will perform UV Photolithography. They will use a spin coater to create thin films of photosensitive resin and use a photomask to pattern a functional QR code. This mimics the industrial process used to manufacture semiconductor microchips.
2. Materials & Consumables
- Spin Coater: Instras Scientific SCK-300 (or similar).
- UV Source: UV Curing Box (405nm). Must have safety interlock.
- Resin A (Base): Standard White 3D Printer Resin.
- Resin B (Active): Standard Black 3D Printer Resin.
- Substrates: 50mm x 50mm Glass or PMMA squares.
- Barrier Film (CRITICAL): FEP Film (Fluorinated Ethylene Propylene).
- Source: Spare FEP sheets for 3D printer vats. Cut into 50mm squares.
- Purpose: Non-stick surface. Prevents resin from bonding to the mask.
- Developer: Isopropyl Alcohol (IPA) 90%+.
3. The Secret Message (The Quiz)
Generating the "Blind" Mask
To verify the students successfully fabricated the device, encode a secret text string into the QR code. Because the mask is inverted (Negative), students generally cannot scan the mask itself with a standard phone camera.
- Generate a QR code containing a code, e.g., "LITHO-SUCCESS-2025".
- Invert the colors (White squares on Black background).
- Print this on the transparency.
- Students must fabricate the chip to revert the polarity and read the code.
4. Process Parameters (Master Recipe)
Use these values to program the spin coater and UV box.
| Layer |
Step 1: Spread |
Step 2: Spin |
UV Cure Time (Box) |
| 1. White Base |
500 RPM (10s) |
2500 RPM (30s) |
60 - 90 seconds |
| 2. Black Active |
500 RPM (10s) |
2500 RPM (30s) |
20 - 30 seconds* |
*Exposure time is critical. >45s will cure the background (overexposure). < 15s will wash away the image (underexposure).
5. Grading Rubric (Total: 100 pts)
| Category | Points | Criteria |
| Functionality | 30 | QR Code scans instantly. Matches Secret Message. |
| Film Quality | 25 | Smooth, glossy films. No bubbles, comets, or dewetting. |
| Lithography | 25 | Sharp pixel edges. No "bridging" or fuzziness. |
| Safety/Process | 10 | Proper PPE usage. Clean workstation. |
| Analysis | 10 | Student understands "Negative Resist" concept. |
EXPERIMENT 01
Student Lab Manual: UV Lithography
Name: ______________________________ Date: _______________
1. Objective
To fabricate a functional data-storage device (a QR Code) using industrial microfabrication techniques. You will verify your success by decoding the hidden message inside the fabricated chip.
2. Theory
Photolithography is the process of transferring a geometric pattern from a photomask to a light-sensitive chemical "photoresist" on a substrate.
Negative Photoresist System
In this lab, we use 3D printer resin as a Negative Resist:
- Exposed Areas: Polymerize (harden) and remain on the substrate.
- Unexposed Areas: Remain liquid and dissolve in the developer solvent.
To create a black QR code on a white background, we coat a white base layer, then a black active layer, and expose it through a mask that only lets light hit the "black" pixels.
3. Safety
- UV HAZARD: Never look directly at the UV light source. Ensure the Curing Box door is closed before activation.
- CHEMICAL HAZARD: Resin is a skin irritant. Nitrile gloves and Safety Glasses are MANDATORY. If resin touches skin, wash immediately with soap and water (not alcohol).
4. Procedure
Phase A: The Base Layer (White)
- Clean: Wipe your 50mm substrate with Isopropyl Alcohol (IPA).
- Dispense: Place substrate on the spin chuck. Pour a coin-sized amount (~1ml) of White Resin in the center.
- Spin: Run the program:
- Spread: 500 RPM for 10s.
- Thinning: 2500 RPM for 30s.
- Cure: Place in UV Box for 60-90 seconds.
- Clean: Wipe the hard surface firmly with an IPA-soaked paper towel to remove the sticky layer.
Phase B: The Active Layer (Black)
- Dispense: Pour ~1ml of Black Resin onto the cured white base.
- Spin: Run the same program (500 RPM -> 2500 RPM).
- REST: Wait 30 seconds for bubbles to pop. Do not cure yet!
Phase C: Contact Lithography (The Critical Step)
We use FEP Film (Fluorinated Ethylene Propylene) as a barrier. This is a special non-stick plastic used in 3D printing. Resin will not stick to it, allowing you to peel it off without damaging your QR code.
- The Stack: Assemble the following stack on the floor of the UV box (remove turntable if present):
- Substrate (Bottom, with wet black resin).
- FEP Barrier Film: Gently roll the FEP sheet onto the wet resin. Avoid trapping bubbles.
- Photomask: Place your QR transparency on top of the FEP.
- Weight: Place a clean glass slide on top to press the mask flat.
- Expose: Close the door. Cure for 20 - 30 seconds.
Phase D: Development
- Peel: Remove the weight and mask. Gently peel off the FEP film. The resin should separate easily from the FEP but stick to the white base.
- Develop: Spray or submerge the substrate in IPA. Agitate gently for 60 seconds. The unexposed black resin will wash away, revealing the white background.
- Dry: Use compressed air to dry the chip.
- Final Cure: Place the dry chip in the UV box for 60 seconds to fully harden the surface.
- Test: Attempt to scan the code with your phone.
5. Troubleshooting Matrix
| Observation |
Likely Cause |
Correction |
| Entire black layer washes away. |
Underexposure |
Increase UV time by 10s. |
| QR Code is solid black block. |
Overexposure |
Decrease UV time. Light "bled" into the background. |
| Image is blurry / fuzzy. |
Poor Contact |
Press the glass weight down firmly. Gap between mask and resin was too large. |
| Resin stuck to FEP film (rare). |
Dirty FEP |
Ensure FEP sheet is clean. Do not use scratched FEP. |
6. Post-Lab Questions
Question 1: The Result
Scan your final fabricated chip with your smartphone. What text message is encoded in the QR Code?
Decoded Text: ___________________________________
Question 2: The Polarity
Look at your Photomask and your Final Chip. Why did the mask look different (inverted) compared to the final chip? Why couldn't you easily scan the mask itself?
Question 3: The Process
Why did we use FEP film instead of standard transparency plastic as the barrier layer?